Server solution

Supermicro BigTwin™ Solutions

Supermicro BigTwin™ Solutions

BigTwin™ is the First and Only 2U Multi-Node System supporting the highest performance 205 watt processors, full 24 DIMMs of memory, 24 All-Flash NVMe Drives and an industry leading 30% better thermal capacity – optimized for today and future proofed for the next generation of technology breakthroughs.

Product Brief

BIGTWIN – THE INDUSTRY’S HIGHEST PERFORMING TWIN MULTI-NODE SYSTEM
First and Only 2U Multi-Node Systems supporting 205 watt dual-Xeon Processors, 24 DIMMs per node, and 24 All-Flash NVMe

EXECUTIVE SUMMARY

  • No-compromise 5th Generation Twin architecture delivers the highest performance and efficiency in a 2U 4-node platform.
  • The first and only multi-node system that supports the widest TDP range of CPUs (up to 205 watts), fully exploits all memory channels with 24 DIMMs per node and 24 All Flash NVMe drives.
  • 30% better thermal capacity in a compact 2U form factor enables configurations with the highest performance processor, memory, storage and I/O leveraging the Titanium level 96% efficient PowerStick power supplies (2200W/2600W)
  • 100% more I/O capacity and added flexibility with more than 10 networking options including 1GbE, 10G, 25G, 100G, IB and industry leading SIOM modular interconnect.
  • Each node can support current and next generation dual Intel Xeon processors with up to 3TB of memory, 24 drives of All-Flash NVMe, Hybrid NVMe/SATA/SAS, SSD and HDD, plus 2 m.2 NVMe/SATA per node.
    Visit Supermsite for full info SuperMicro’s website

Supermicro BigTwin™ Solutions :


SuperServer 2028BT-HNR+

Compute Intensive Application, HPC, Data Center – Enterprise Server, Financial Analysis, Mission-critical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots
  3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  4. IPMI 2.0 + KVM with dedicated LAN
  5. 6 Hot-swap 2.5″ NVMe drive bays
  6. Video via Aspeed AST2400 BMC
  7. 4x 8cm heavy duty PWM fans with air shroud
  8. 2200W Redundant Power Supplies Titanium Level
  9. 2 x M.2 Cards support

SuperServer 2028BT-HNC0R+

Hyperscale and Hyperconverged Solutions, Compute Intensive Application, HPC, Data Center, Enterprise Server

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots
  3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  4. IPMI 2.0 + KVM with dedicated LAN
  5. 6 SAS3 or 4 NVMe + 2 SAS3 Hot-swap 2.5″ drive bays
  6. SAS3 support via LSI 3008;RAID 0, 1, 10
  7. Video via Aspeed AST2400 BMC
  8. 4 x 8cm heavy duty PWM fans with air shroud
  9. 2200W Redundant Power Supplies Titanium Level
  10. 2 x M.2 Cards support

SuperServer 2028BT-HTR+

Financial Analysis, Compute Intensive Application, Enterprise Server, Mission-critical applications

Four hot-pluggable systems (nodes) in a 2U form factor. Each node supports the following:

  1. Dual socket R3 (LGA 2011) supports Intel® Xeon® processor E5-2600 v4†/ v3 family; QPI up to 9.6GT/s
  2. Up to 3TB† ECC 3DS LRDIMM , up to DDR4- 2400†MHz ; 24x DIMM slots
  3. 2 PCI-E 3.0 x16 (LP) slots; 1 SIOM card support (flexible networking) Note: must bundle with Network card
  4. IPMI 2.0 + KVM with dedicated LAN
  5. 6 Hot-swap 2.5″ SATA3 drive bays
  6. Video via Aspeed AST2400 BMC
  7. 4x 8cm heavy duty PWM fans with air shroud
  8. 2200W Redundant Power Supplies Titanium Level

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